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Product
Build-Up/BVH
Flexible/Rigid-Flexible
Silver Through Hole
Metal Based
Heavy Copper
Memory Module
Technology
Special Technology
 
Product
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Silver Through Hole

Specifications
Material FR-1,CEM-1,CEM-3
Layer 2
Thickness 0.8T~1.6T
Line/Space 180㎛/180㎛
Min.Hole 0.5Φ
STH(Ω) ↓100mΩ/Hole
Allowable Current Max.300mA/Hole
Application DVD-ROM,CD-ROM
Print&Fax Machine

Feature
  - Significant Cost Reduction to the Cutomer
  - Technology replacement of Conventional Double side Plated through hole board designs
  - Lead Free for Saving the Enviroment.

 
     
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