TGFR is the technique and process for filling the conductor spaces, which copper thickness is over 5oz, with special resin.
Effect
Excellent withstanding voltage and insulation between tracks Effect on keeping thermal balance on PCB surface while it’s operating Increase thermal effects for bare boards & surface mounted components Secure reliability in insulation at operating condition like high temperature and humidity Prevent soldering short & contamination while assembling Reduce bow & twist of PCB and defect rate in assembling process by filling conductor space Diminish heavy copper PCB weight & size by thinner insulation layer. Diminish PCB layer Reduce thickness of dielectric layers for multi-copper thickness PCB
Application
HICH CURRENT PRODUCT AUTO MOBILE DC/DC CONVERTER JUNCTION BOX
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TGFR: Track Gap Filled Resin
Effect
Excellent withstanding voltage and insulation between tracks